WebMeishan Boya New Material Co., Ltd. 机构总部: 东坡区. 注册地点: 东坡区. 成立时间: 2016年. 所属行业: 新材料. 官方网站: www.boya-materials.com. 注:以上所有数据 … WebThe applicant listed for this patent is MEISHAN BOYA ADVANCED MATERIALS CO., LTD.. Invention is credited to Min LI, Zhenxing LIANG, Yu WANG, Tian YANG. Application Number: 20240317594 17/242263: Document ID / Family ID: 1000005595357: Filed Date: 2024-10-14: United States Patent Application: 20240317594:
Boya Advanced Materials Company Profile: Valuation & Investors PitchBook
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Yan Zhang - Senior S.. - Meishan Boya Advanced Materials
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