WebThe aim of this Special Issue is to bring together original research and review articles concerning issues arising in advanced packaging for MEMS and sensors. The Virtual Special Issue will serve as a point of reference for the 3D wafer level chip scale packaging (3D WLCSP), fan-out wafer level packaging (FO-WLP), 2.5D/3D integration using ... WebGan et al. conducted studies on effects of bonding wires on UHAST and TC reliability and found Au with better UHAST reliability compare to Cu wire [25] [26][27][28][29][30][31]. Au …
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BHAST (Biased Highly Accelerated Stress Tests)
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